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INTEGRATED CIRCUITS
DATA SHEET
PCF84C12A; PCF84C22A; PCF84C42A 8-bit microcontrollers
Product specification Supersedes data of 1996 Apr 04 File under Integrated Circuits, IC14 1996 Nov 20
Philips Semiconductors
Product specification
8-bit microcontrollers
CONTENTS 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 13.1 13.2 13.2.1 13.2.2 13.3 13.3.1 13.3.2 13.3.3 14 15 FEATURES GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description INSTRUCTION SET ROM MASK OPTIONS HANDLING LIMITING VALUES DC CHARACTERISTICS AC CHARACTERISTICS PACKAGE OUTLINES SOLDERING Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS
PCF84C12A; PCF84C22A; PCF84C42A
1996 Nov 20
2
Philips Semiconductors
Product specification
8-bit microcontrollers
1 FEATURES 2
PCF84C12A; PCF84C22A; PCF84C42A
GENERAL DESCRIPTION
* Manufactured in silicon gate CMOS process * 8-bit CPU, ROM, RAM, I/O in a 20-lead package * 1 kbyte ROM (PCF84C12A) * 2 kbyte ROM (PCF84C22A) * 4 kbyte ROM (PCF84C42A) * 64 byte RAM * Over 100 instructions (based on MAB8048) all of 1 or 2 cycles * 13 quasi-bidirectional I/O port lines * 8-bit programmable timer/event counter 1 * Two single-level vectored interrupts: - external - 8-bit programmable timer/event counter 1 * Two test inputs, one of which also serves as the external interrupt input * Stop and Idle modes * Supply voltage: 2.5 to 5.5 V * Clock frequency: 1 to 16 MHz * Operating temperature: -40 to +85 C. 3 ORDERING INFORMATION (see note 1)
This data sheet details the specific properties of the PCF84C12A, PCF84C22A and PCF84C42A. The shared properties of the PCF84CxxxA family of microcontrollers are described in the "PCF84CxxxA family" data sheet, which should be read in conjunction with this publication. Note that the devices described in this data sheet do not feature I2C-bus compatibility or derivative logic, so the information given in the family data sheet about these features can be ignored. The PCF84C12A, PCF84C22A and PCF84C42A are general purpose CMOS microcontrollers with 1 kbyte, 2 kbytes and 4 kbytes of program memory, respectively. They include 64 bytes of RAM and 13 I/O port lines. The instruction set is based on the MAB8048 and is a sub-set of that listed in the "PCF84CxxxA family" data sheet.
PACKAGE TYPE NUMBER NAME PCF84C12AP PCF84C22AP PCF84C42AP PCF84C12AT PCF84C22AT PCF84C42AT Note 1. Please refer to the Order Entry Form (OEF) for these devices for the full type number to use when ordering. This type number will also specify the required program and ROM mask options. SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 DIP20 DESCRIPTION plastic dual in-line package; 20 leads (300 mil) VERSION SOT146-1
1996 Nov 20
3
4
P1.0 to P1.4 P0.7 to P0.0 3 PORT 1 BUFFER PORT 0 BUFFER PORT 0 FLIP-FLOPS PORT 1 FLIP-FLOPS RESIDENT ROM 1 kbyte (PCF84C12A) 2 kbytes (PCF84C22A) 4 kbytes (PCF84C42A) DECODE
handbook, full pagewidth
1996 Nov 20 BLOCK DIAGRAM
Philips Semiconductors
8-bit microcontrollers
INTERNAL CLOCK FREQ. 30 HIGHER PROGRAM COUNTER LOWER PROGRAM COUNTER PROGRAM STATUS WORD
MEMORY BANK FLIP-FLOPS
32 TEST 1
TIMER/ EVENT COUNTER
5
5
8
8
8
8
8
8
8
8
8
8 MULTIPLEXER
4
TEMPORARY REGISTER 1 TEMPORARY REGISTER 2 RAM ADDRESS REGISTER ARITHMETIC LOGIC UNIT INSTRUCTION REGISTER & DECODER REGISTER 0 REGISTER 1 REGISTER 2 REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 INT / T0 (8) TEST 1 TIMER FLAG CONDITIONAL BRANCH LOGIC CARRY ACC XTAL 2 ACC BIT TEST RESIDENT RAM ARRAY 64 bytes
MBC951
INTERRUPT LOGIC
ACCUMULATOR
timer interrupt
D E C O D E
8 LEVEL STACK (VARIABLE LENGTH) OPTIONAL SECOND REGISTER BANK
external interrupt DECIMAL ADJUST
DATA STORE
STOP CONTROL & TIMING INT / T0 INITIALIZE OSCILLATOR RESET XTAL 1
IDLE
INTERRUPT
PCF84C12A; PCF84C22A; PCF84C42A
Product specification
Fig.1 Block diagram of PCF84C12A, PCF84C22A and PCF84C42A.
Philips Semiconductors
Product specification
8-bit microcontrollers
5 5.1 PINNING INFORMATION Pinning 5.2
PCF84C12A; PCF84C22A; PCF84C42A
Pin description DIP20 and SO20 packages PIN 1 to 8 TYPE I/O DESCRIPTION 8 bits of Port 0: 8-bit quasi-bidirectional I/O port Interrupt/Test 0 ground Test 1/count input of 8-bit timer/event counter 1 crystal oscillator input or external clock input crystal oscillator output Reset input 4 bits of Port 1: 4-bit quasi-bidirectional I/O port positive supply
Table 1
SYMBOL P0.0 to P0.7
P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 INT/T0 1 2 3 4 5 6 7 8 9 20 V DD 19 18 17 PCF84C12A 16 PCF84C22A PCF84C42A 15 14 13 12 11
MBC952
P1.4
INT/T0
P1.3 P1.2 P1.1 P1.0
9 10 11
I P I
VSS T1
XTAL1
RESET XTAL2 XTAL1 T1
12
I
XTAL2 RESET P1.0 to P1.4
13 14 15 to 19
O I I/O
VSS 10
Fig.2 Pin configuration. VDD 6 INSTRUCTION SET 20 P
Since the I2C-bus interface, Port 2 and derivative logic are not provided, instructions associated with these functions are not available. ROM space is restricted to 1 kbyte for the PCF84C12A, 2 kbytes for the PCF84C22A and 4 kbytes for the PCF84C42A. Therefore, the instructions SEL MB1/2/3 for the PCF84C12A and PCF84C22A, and the instructions SEL MB2/3 for PCF84C42A should be avoided as they would define non-existing program memory banks. As RAM space is limited to 64 bytes, care should be taken to avoid accesses to non-existing RAM locations. Refer to the "PCF84CxxxA family" data sheet, for a complete description of the instruction set.
1996 Nov 20
5
Philips Semiconductors
Product specification
8-bit microcontrollers
7 ROM MASK OPTIONS ROM CODE Program/data
PCF84C12A; PCF84C22A; PCF84C42A
OPTION Any mix of instructions and data up to ROM size of 1 kbyte for the PCF84C12A, 2 kbytes for the PCF84C22A and 4 kbytes for the PCF84C42A.
Port Output P0.0 to P0.7 P1.0 to P1.4 Port State after reset P0.0 to P0.7 P1.0 to P1.4 Oscillator Transconductance 8 HANDLING LOW (gmL) MEDIUM (gmM) HIGH (gmH) set set reset reset - - standard standard open-drain open-drain push-pull push-pull
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices. See "Data Handbook IC14, Section: Handling MOS devices". 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO Ptot PO IDD ISS Tstg Tj supply voltage all input voltages DC input current DC output current except Port 1 output LOW total power dissipation power dissipation per output supply current ground supply current storage temperature range operating junction temperature PARAMETER MIN. -0.5 -0.5 -10 -10 - - -50 -100 -55 - +7 VDD + 0.5 +10 +10 125 30 +50 +50 +150 90 MAX. V V mA mA mW mW mA mA C C UNIT
1996 Nov 20
6
Philips Semiconductors
Product specification
8-bit microcontrollers
PCF84C12A; PCF84C22A; PCF84C42A
10 DC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL VDD IDD PARAMETER operating supply voltage operating supply current see Fig.3 note 1; see Figs 4 and 5 VDD = 3 V; fxtal = 3.58 MHz (gmL) VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(idle) supply current (Idle mode) note 1; see Figs 6 and 7 VDD = 3 V; fxtal = 3.58 MHz (gmL) VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(stp) Inputs VIL VIH ILI Outputs IOL IOH IOH1 LOW level output sink current HIGH level pull-up output source current HIGH level push-pull output source current VDD = 5 V; VO = 0.4 V; see Fig.9 VDD = 5 V; VO = 3.5 V; see Fig.10 VDD = 5 V; VO = 0 V; see Fig.10 VDD = 5 V; VO = 4.6 V; see Fig.11 1.6 40 - -1.6 12 100 -7 - - - mA A A mA LOW level input voltage HIGH level input voltage input leakage VSS VI VDD 0 -1 - - 0.3VDD V VDD +1 V A 0.7VDD - supply current (Stop mode) VDD = 2.5 V; notes 1 and 2; see Fig.8 - - - - - 0.2 0.8 1.2 1.7 1.2 0.4 1.6 4.0 5.0 10 mA mA mA mA A - - - - 0.3 1.1 1.7 2.5 0.6 3.0 5.0 6.0 mA mA mA mA CONDITIONS MIN. 2.5 TYP. - MAX. 5.5 UNIT V
-140 -400
Oscillator (see Fig.12) gmL gmM gmH RF LOW transconductance MEDIUM transconductance HIGH transconductance feedback resistor VDD = 5 V VDD = 5 V VDD = 5 V 0.2 0.9 3.0 0.3 0.4 1.6 4.5 1.0 1.0 3.2 9.0 3.0 mS mS mS M
Notes 1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values at 25 C with crystal connected between XTAL1 and XTAL2). 2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open drain outputs connected to VSS; all other outputs open.
1996 Nov 20
7
Philips Semiconductors
Product specification
8-bit microcontrollers
PCF84C12A; PCF84C22A; PCF84C42A
MBC953 - 1
handbook, halfpage
18
3 I DD (mA) 2
MBC955
f xtal (MHz) 12
16 MHz
10 MHz guaranteed operating range 1 3.58 MHz
6
0 1 3 5 V DD (V) 7
0 1 3 5 V DD (V) 7
Supply current based on optimal oscillator selection.
Fig.3
Maximum clock frequency as a function of operating supply voltage (VDD).
Fig.4
Typical operating supply current (IDD) as a function of operating supply voltage (VDD).
3 I DD (mA) 2 5V
MBC956
handbook, halfpage
3
MBC957
IDD(idle) (mA) 2
16 MHz 1 3V 1 10 MHz 3.58 MHz
0 0.1
1
10 fxtal(MHz)
100
0 1 3 5 V DD (V) Supply current based on optimal oscillator selection. 7
Supply current based on optimal oscillator selection.
Fig.6 Fig.5 Typical operating supply current (IDD) as a function of clock frequency (fxtal).
Typical supply current in Idle mode (IDD(idle)) as a function of operating supply voltage (VDD).
1996 Nov 20
8
Philips Semiconductors
Product specification
8-bit microcontrollers
PCF84C12A; PCF84C22A; PCF84C42A
handbook, halfpage
3
MBC958
MBC954
handbook, halfpage
3
IDD(idle) (mA) 2
IDD(stp) (A) 2
85 C 1 5V 1 25 C
o
o
3V 0 0.1 0 1 3 5 V DD (V) 7
1
10 fxtal(MHz)
100
Supply current based on optimal oscillator selection.
Fig.8 Fig.7 Typical supply current in Idle mode (IDD(idle)) as a function of clock frequency (fxtal).
Typical supply current in Stop mode (IDD(stp)) as a function of operating supply voltage (VDD).
16 I OL (mA) 12
MBC959
300 I OH (A) 200
MBC960
VO = VSS
8
100
VO = 0.7 V DD
4 1 3 5 V DD (V) 7
0 1 3 5 V DD (V) 7
VO = 0.4 V.
Fig.9
Typical LOW level output sink current (IOL) as a function of operating supply voltage (VDD).
Fig.10 Typical HIGH level pull-up output source current (IOH) as a function of operating supply voltage (VDD).
1996 Nov 20
9
Philips Semiconductors
Product specification
8-bit microcontrollers
PCF84C12A; PCF84C22A; PCF84C42A
handbook, halfpage
12
MBC961
handbook, halfpage
6
MBC962
I OH1 (mA) 8
gm (mS) 4
g mH
4
2
g mM
g mL 0 1 3 5 V DD (V) 7 0 1 3 5 V DD (V) 7
VO = VDD - 0.4 V.
Fig.11 Typical HIGH level push-pull output source current (IOH1) as a function of operating supply voltage (VDD).
Fig.12 Typical transconductance values (gm) as a function of operating supply voltage (VDD) for the options gvmL, gmM and gmH.
11 AC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL tr tf fxtal PARAMETER rise time all outputs fall time all outputs clock frequency CONDITIONS VDD = 5 V; Tamb = 25 C; CL = 50 pF VDD = 5 V; Tamb = 25 C; CL = 50 pF see Fig.3 MIN. - - 1 TYP. 30 30 - MAX. - - 16 UNIT ns ns MHz
1996 Nov 20
10
Philips Semiconductors
Product specification
8-bit microcontrollers
12 PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil)
PCF84C12A; PCF84C22A; PCF84C42A
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
1996 Nov 20
11
Philips Semiconductors
Product specification
8-bit microcontrollers
PCF84C12A; PCF84C22A; PCF84C42A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1996 Nov 20
12
Philips Semiconductors
Product specification
8-bit microcontrollers
13 SOLDERING 13.1 Introduction
PCF84C12A; PCF84C22A; PCF84C42A
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 13.3.2 WAVE SOLDERING
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). 13.2 13.2.1 DIP SOLDERING BY DIPPING OR BY WAVE
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.3.3 REPAIRING SOLDERED JOINTS
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 13.3 13.3.1 SO REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Nov 20
13
Philips Semiconductors
Product specification
8-bit microcontrollers
14 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCF84C12A; PCF84C22A; PCF84C42A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 15 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Nov 20
14
Philips Semiconductors
Product specification
8-bit microcontrollers
NOTES
PCF84C12A; PCF84C22A; PCF84C42A
1996 Nov 20
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
457021/1200/04/pp16
Date of release: 1996 Nov 20
Document order number:
9397 750 01086

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